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Lightspring raises €3.5M to tackle photonic chip manufacturing bottleneck, led by Atlantic and OVNI Capital, with additional participation. The funding will enhance their innovative optical interface manufacturing capabilities.
Amount Raised
€3.1 Million
Round Type
€3.1 million seed round
Investors
Description
French company Lightspring announced the close of a €3.1 million seed round led by Atlantic and OVNI Capital, with participation from Concept Ventures, Ixcore, Plug and Play Ventures, and industry business angels. The funding aims to tackle challenges in photonic chip manufacturing bottlenecks by advancing their optical interface solutions. Lightspring focuses on integrating optical packaging with 3D lithography technology to improve efficiency and reduce costs in photonic integrated circuits. This funding will support Lightspring's mission to industrialize optical packaging processes.
Fundz sees it the moment Lightspring raises, hires an exec or expands, usually minutes after it happens, and tells you who to reach.
Funding Insights
Based on industry dataLightspring raised. Fundz records a round at a median of 3.6 minutes from the SEC filing, with the decision-maker attached.
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