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TDS Innovation raises $4.8M in pre-Series A funding led by LB Investment for 2D semiconductor deposition equipment development.

PRIVATENov 03, 2026

Amount Raised

$4.8 Million

Round Type

Pre-Series A

South KoreaManufacturing

Investors

Stonebridge VenturesFutureplayDaejeon Investment FinanceIBK Venture InvestmentIbk(industrial Bank Of Korea)LB Investment

Description

TDS Innovation, a developer of deposition equipment and materials for 2D semiconductors, raised $4.8 million in a pre-Series A round. LB Investment led the round, with IBK Industrial Bank of Korea, IBK Venture Investment, and Daejeon Investment Finance participating as new investors. Existing investors Futureplay and Stonebridge Ventures also joined the follow-on investment. The company plans to use the funds for full-scale development of production-ready 2D semiconductor deposition equipment for 300mm wafers.

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Company Information

Company

TDS Innovation

Location

South Korea

About

TDS Innovation develops deposition equipment, process technology and core precursor materials for 2D semiconductors on large-area wafers. The company specializes in Crystal Layer Deposition (CLD) technology to form ultra-thin 2D semiconductor materials uniformly for next-generation chip manufacturing. Their integrated offering combines equipment, materials and processes to address the manufacturing challenges of 2D semiconductors used in high-density chips and 3D stacking applications.

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TDS Innovation raised. Fundz records a round at a median of 3.6 minutes from the SEC filing, with the decision-maker attached.

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