Round Type
Debt Financing
Description
Sierra Wireless, Inc. (NASDAQ: SWIR) (TSX: SW), a world leading IoT solutions provider, today announced that it has entered into a credit agreement for a new debt financing facility with CIBC Innovation Banking as administrative agent, and CIBC Innovation Banking and the Business Development Bank of Canada (BDC) as lenders. The new debt facility is for CAD$60 million and has a term of four years. The new facility will provide additional liquidity to the company’s balance sheet.
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