NextFlex Launches $14 Million Funding Round for Flexible Hybrid Electronics Innovations to Address Manufacturing Challenges and Improve Reliability
NextFlex Launches $14 Million Funding Round for Flexible Hybrid Electronics Innovations to Address Manufacturing Challenges and Improve Reliability
02/15/21, 1:02 PM
Location
san joseMoney raised
$14 million
Industry
manufacturing
information technology
software
NextFlex®, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, today released Project Call 6.0 (PC 6.0). The latest call for proposals seeks to fund projects that further the development and adoption of FHE while addressing key challenges in advanced manufacturing. The total PC 6.0 project value is expected to exceed $14.3M (project value/investment figures include cost-sharing), bringing the total anticipated investment in advancing FHE since NextFlex’s formation to $113M.
Company Info
Location
san jose, california, united states
Additional Info
NextFlex is a DoD sponsored Manufacturing Innovation Institute funded by Air Force Research Laboratory Cooperative Agreement numbers FA8650-15-2-5402 and FA8650-20-2-5506. NextFlex is a consortium of companies, academic institutions, non-profits and state, local and federal governments with a shared goal of advancing U.S. manufacturing of FHE. Since its formation in 2015, NextFlex’s elite team of thought leaders, educators, problem solvers and manufacturers have come together to collectively facilitate innovation, narrow the manufacturing workforce gap and promote sustainable manufacturing ecosystems. For more information, visit www.nextflex.us and follow NextFlex on LinkedIn, Facebook and Twitter.