Lingshu Zhifu raises over 10 million yuan in back-to-back seed and angel rounds to fund pilot production line for flexible tactile sensing materials.
Amount Raised
¥10 Million
Round Type
Seed
ShanghaiManufacturingRoboticsDescription
Lingshu Zhifu Electronic Technology Co., Ltd. has closed back-to-back seed and angel funding rounds, raising more than 10 million yuan in total. The company, founded in April 2025 by Jia Wei, develops flexible tactile sensing materials and devices using ionic skin technology. Proceeds will primarily fund the construction of a pilot production line for materials and customer sampling
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Lingshu Zhifu Electronic Technology Ltd raised. Fundz records a round at a median of 3.6 minutes from the SEC filing, with the decision-maker attached.
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