DayOne Data Centers seeks HK$1.86 billion (US$237 million) loan from DBS, OCBC, and UOB for capital expansion ahead of a planned US IPO.
Amount Raised
$237 Million
Round Type
Debt Financing
Investors
Description
DayOne Data Centers is in talks with Asian banks for a five-year loan to expand its Hong Kong facility. The loan will be used for refinancing and capital expansion as demand for AI capacity surges. This comes as the company prepares for a potential US IPO. DayOne previously secured a loan from these banks for its operations in Singapore.
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Funding Insights
Based on industry dataDayOne Data Centers raised. Fundz records a round at a median of 3.6 minutes from the SEC filing, with the decision-maker attached.
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