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Multibeam Corporation signs a letter of intent for $140 million in federal funding from the U.S. Department of Commerce to advance chip packaging technology.

Jul 31, 2026•9 days ago
Santa ClaraManufacturing

Description

Multibeam Corporation has announced a letter of intent for a proposed federal funding of $140 million, awarded by the CHIPS Research and Development Office. This funding aims to accelerate R&D for advanced packaging processes for U.S. chip manufacturers. The project builds on advancements in semiconductor manufacturing equipment

Company Information

Company

Multibeam

Location

Santa Clara, California, United States

About

Multibeam Corp. is focused on developing next-generation multi-column E-Beam Lithography (EBL) solutions for advanced semiconductor manufacturing. Their innovative platform addresses the needs of the silicon ecosystem by enabling maskless lithography for various applications, including quantum computing and AI technologies. Since its inception, Multibeam has positioned itself as a leader in high-productivity electron beam-based patterning solutions, aimed at enhancing chip design and manufacturing processes.

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