SJ Semiconductor Co. (SJSemi), a leading MEOL (Middle-End-Of-Line) foundry specializing on advanced Bumping and 3D Multi-Die Integration technology, is pleased to announce that its Series C financing of $300 million has been fully closed.

Located in Jiangyin, Jiangsu province, SJSemi is China's first 300mm MEOL (Middle-End-Of-Line) foundry specializing in advanced Bumping and wafer-level packaging (WLP). The Company was founded in August 2014, started 28/14nm bumping for Smartphone AP chips in 2016, and is the first one to provide bumping for advanced DRAM and 12" power management chips in the Mainland of China.

Sjsemi Successfully Closed $300M Of Series C Financing

Description

Company Information

Funding Insights