Lendsmart announced it raised $3.77 Million in an initial filing from an offering of $3.77 Million

Nov 13, 2023•about 2 years ago

Amount Raised

$3.77 Million

Round Type

seed

New YorkInformation Technology

Company Information

Company

LENDSMART

Location

208 HUDSON STREET

New York, New York, United States

About

Lendsmart's Engagement Banking Platform empowers banks & credit unions with cutting-edge technology to provide value to their customers across the entire financial life journey.

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Lendsmart announced it raised $3.77 Million in an initial filing from an offering of $3.77 Million

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Company Information