Bondingai announced it raised $100,000 in an initial filing from an offering of $750,000

May 15, 2025•7 months ago

Amount Raised

$100,000

Round Type

pre-seed

IssaquahInformation Technology

Company Information

Company

BondingAI

Location

2428 35TH AVENUE NE

Issaquah, Washington, United States

About

BondingAI is the only platform that offers a scalable, all-in-one solution, enabling enterprises to create their own LLM to drive transformation at scale without the need for fragmented tools.

Related People

2 contacts

Funding Insights

Based on industry data

Tech investment trends

83% of B2B companies plan digital investments, with 79% prioritizing customer experience tech

Bondingai announced it raised $100,000 in an initial filing from an offering of $750,000

.css-1v6jzuu{--tw-text-opacity:1;color:rgba(75, 85, 99, var(--tw-text-opacity));}Company Information

Related People

Funding Insights

Company Information